TH58TEG8H2HBA89
  • image of TH58TEG8H2HBA89

TH58TEG8H2HBA89

Manufacturer:
Description:
256GB SLC NAND
Package:
Packaging:
Tray
RoHS:
YES

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Specifications
Part Status
Active
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C
Grade
-
Qualification
-
Write Cycle Time - Word, Page
-
Memory Type
Non-Volatile
Memory Interface
SPI
Voltage - Supply
2.7V ~ 3.6V
Memory Format
FLASH
Technology
FLASH - NAND (SLC)
Memory Size
256Gbit
Memory Organization
32G x 8
Package / Case
132-BGA
Supplier Device Package
132-BGA